SOI surface micromachining and SOI bulk micromachining

Tronics is the recognized leader in applying advanced SOI MEMS micromachining technologies to the development and manufacturing of demanding custom commercial products. Available technologies are based on:

• Thick SOI High Aspect Ratio Micromachining (SOI H.A.R.M.) up to 1:30 aspect ratio in repeatable series manufacturing
• Surface micromachining on Epitaxied SOI wafers
• SOI bulk micromachining

Tronics' expertise in applying Deep-Reactive Ion Etching (DRIE) on SOI technologies to MEMS structures includes:

• Capacitive High-Q factor resonating structures
• Capacitive and electrostatic surface and gap variation comb-drives
• Electrostatic vertical comb-drive actuators
• Stress-controlled, highly reflective single-crystal micro-mirrors
• SOI-gauge piezoresistors
• Cantilever-based microstructures on thin-SOI membranes
• Microfluidic devices with precise thickness and volume control

With nearly a decade of manufacturing extreme-performance and miniature sensors and actuators for demanding applications, Tronics has leveraged and capitalized on CEA-LETI's 20 years of R&D background on SOI-MEMS technologies. Our intensive efforts at advanced engineering, qualification, characterization, manufacturability, SPC and reliability have lead us to our No. 1 position in the industry.

Tronics also offers MEMSOI, a Europractice-accredited Multi-Project Wafer (MPW) service on its proven 60µm thick SOI H.A.R.M. technology.