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![]() Surface and Bulk Micromachining DRIEWafer Level Packaging, high vacuum packagingTronics is the leader at developing, qualifying and industrializing specialized technologies to make and deliver reliable and manufacturable custom components. Starting with customers' design concept, drawing or functional prototype, Tronics provides a complete and extensive toolset and proven process portfolio to guide them through design-for-manufacturability, industrialization and production of their custom MEMS components and micro-structured devices. Tronics has mastered the key MEMS technologies of surface, bulk and High Aspect Ratio Micromachining and is the leading manufacturer of custom components on SOI.
We also guide our customers in developing, qualifying and implementing solutions and reliable supply chains for specialized packaging. Today, Tronics offers unique expertise in Wafer Level Packaging and Vacuum Wafer Level Packaging, and is a leader in manufacturing and delivering extreme performance sensors packaged under high vacuum.
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