Tronics Microsystems : MEMS devices
 
 

SOI MEMS MPW

MEMS SOI

Tronics has provided its unique expertise in SOI micromachining as a low-cost MPW service since 1999. We have enabled universities, research centers and companies to train students and staff in this cutting-edge technology, and evaluate structures and innovative concepts cost effectively.

We are the first company to offer a qualified industrial technology of
60µm thick SOI High Aspect Ratio Micromachining featuring hermetic wafer level packaging in a MPW service.
This technology allows the fabrication of innovative structures such as:

  • Capacitive sensors
  • Electrostatic actuators
  • High Q factor resonating structures
  • Electrostatic optical structures
  • Energy scavengers
  • Microfluidics test structures


This service provides universities, research labs and companies with a Design Rules Manual and associated Software Design Kit based on the Coventor tool suite, enabling them to design their own structures and components. They can then submit their designs for production in regular low-cost runs. The result: continuous design improvement.

For each design submitted (one location), we deliver 20 dies, released and protected by a hermetic silicon wafer level package.

 

Chip Characteristics:

Die sizes (mm2)
4x4
4x8
8x8
Available active
area (mm2)
3.5x3.5
3.5x7.5
7.5x7.5
Number of pads or openings on the cap
Up to 12
Up to 18
Up to 24
 + From simple to most complex functions
 + Hermetically sealed or open access
Hermetic Wafer Level Packaging
 + Industry state of the art standard for manufacturing
 + Protection and ease of handling/integration
SOI
SOI = 60 µm     BOX = 2 µm     Bulk = 450 µm
Release
 + Structure released


Planning of the Runs:

Design review/DRC
Run Order and first design submission
(GDSII format)
Final design release
(GDSII format)
Delivery date
N Jan. 1 Jan. 15 April 15
N+1 May 1 May 15 Aug. 15
N+2 Sept. 1 Sept. 15 Dec. 15


Prices of the Runs:
Special pricing is available for universities and research labs.

Die sizes 4x4 mm 4x8 mm 8x8 mm
Academic price 2,500 € 3,500 € 5,000 €
Corporate price 3,750 € 5,000 € 7,500 €

 

 

Additional Services:

100 € per additional die (min. quantities = 10 dies)

200 € per die without release and cap (min. quantities = 5 dies)

Training sessions are provided twice per year through the STIMESI organization, see www.stimesi.org for more information or download the program of the next course.

University and research lab members of the Europractice IC Service can also access the service through IMEC. For more information see www.europractice-ic.com.